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News
Cypress Introduces Single-Chip Automotive MCU Solution that Drives Hybrid Instrument Clusters, Head-up Displays and Traditional Gauges
2016-08-24 | ReturnThe Traveo S6J32xE series features up to 4MB of high-density embedded flash, 512 KB RAM and 2 MB of Video RAM, along with an ARM® Cortex®-R5 core at 240 MHz performance. The MCUs have up to two 12-pin HyperBus memory interfaces that dramatically improve read and write performance of graphical data and other data or code. The devices can use a single HyperBus interface to connect to two memories for Firmware Over-The-Air (FOTA) updates, which enable end-users to get new software fixes, features and applications for their vehicles on-the-go. The series includes a Low-voltage Differential Signaling (LVDS) video output, providing a suitable interface to attach external displays such as Thin-Film-Transistors (TFTs). The MCUs support all in-vehicle networking standards required for instrument clusters, including Controller Area Network-Flexible Data (CAN-FD) and Ethernet AVB. More information on the Traveo MCU family is available at http://www.cypress.com/traveo.
“These new Traveo MCUs are another example of our commitment to expand our automotive portfolio to meet the changing needs of our customers, in this case, addressing the strong growth trend of hybrid clusters and head-up displays,” said Takeshi Fuse, senior vice president of the Automotive Business Unit at Cypress. “These new devices provide automotive manufacturers with a high-performance and cost-effective platform, adding to Cypress’s ability to bring advanced functionality to mainstream vehicles.”
The new Traveo derivatives from the S6J32xE series integrate enhanced secure hardware extension (eSHE) for robust security. The HyperBus interface enables seamless connections with Cypress’s HyperFlash™ and HyperRAM™ memories, which deliver read/write bandwidth of up to 200 MBps per channel in combination with Traveo MCUs. The MCUs include 50 channels of 12-bit Analog to Digital Converters (ADC), 12 channels of multi-function serial interfaces and I2S interfaces and an AUDIO DAC to output the complex, high-quality sounds required in today’s instrument clusters. Support for Ethernet AVB delivers increased bandwidth in multimedia applications and reduced programming time, while a MediaLB interface enables communication with legacy media communication systems. The S6J32xE series supports a wide ambient temperature range of -40˚C to +105˚C.
Availability
The Traveo S6J32xE series is sampling now and will be in production in the early 2017. The MCUs are available in TEQFP-208 and TEQFP-216 packages.
Cypress Enables Leading-Edge Automotive Systems
Cypress works with the world’s top automotive companies to bring leading-edge automotive systems typical of luxury models to mainstream vehicles, including Advanced Driver Assistance Systems (ADAS), 3-D graphics displays and full-featured touchscreens. The Cypress-Spansion merger created the industry’s No. 3 provider of memories and microcontrollers (MCUs) for the automotive market with a combined portfolio that includes the Traveo MCU family, power-management ICs (PMICs), PSoC® programmable system-on-chip solutions, CapSense® capacitive-sensing solutions, TrueTouch® touchscreens, LED drivers, NOR flash, F-RAM™ and SRAM memories, and USB, Wi-Fi and Bluetooth® connectivity solutions. The portfolio is backed by Cypress’s commitment to zero defects, world-class service and by our adherence to the most stringent industry standards, such as the ISO/TS 16949 quality management system, the Automotive Electronics Council (AEC) guidelines for ICs and the Production Part Approval Process (PPAP). Learn more at www.cypress.com/automotive.
Source:http://www.cypress.com/