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Toshiba Launches Photorelays for Semiconductor Testers in Industry‘s Smallest Package

2016-07-11 | Return

For 1.5A large current control and 110 degrees Celsius operation

TOKYO—Toshiba Corporation’s (TOKYO: 6502) Storage & Electronic Devices Solutions Company today announced the launch of photorelays in the industry's smallest[1] package. Shipments start from today.

The new product, "TLP3406S", utilizes the industry's smallest package for photorelays, the Toshiba-developed S-VSON4 package. Compared to Toshiba’s previous products in a VSON4 package, the new photorelay has an approximately 22.5%[2] smaller assembly area, which can contribute to the development of smaller test boards and also make it possible to increase the number of photorelays on a board to increase density. Since the new photorelay can drive large currents of up to 1.5A, in spite of its small package, it can be used in device power supplies (DPS) that make up the power supply circuits in various testers. As a further positive, the operating temperature range has been enhanced from 85 degrees Celsius (max.) to 110 degrees Celsius (max.).

Main Applications

ATE (Automatic Test Equipment), memory testers, SoC/LSI testers and probe cards

Main Specifications

Part Number

V_OFF

(min.)

I_ON

(max.)

R_ON (typ.)

R_ON (max.)

C_OFF (typ.)

CxR

pF.Ω(typ.)

I_OFF (max.)

t_ON (max.)

t_OFF (max.)

BVs (min.)

TLP3406S

30V

1.5A

0.1Ω

0.2

120pF

7.2

1nA@20V

500Vrms

Notes

[1] For photorelay products, as of July 11, 2016. Toshiba survey.

[2] S-VSON4 package: 2.00mm×1.45mm (typ.)

VSON4 package: 2.45mm×1.45mm (typ.)

Follow the links below for more on Toshiba photorelays.
http://toshiba.semicon-storage.com/ap-en/product/opto/photocoupler/photorelay.html

Source：http://www.semicon.toshiba.co.jp/eng/