MILPITAS, CA – June 15, 2016 – Linear Technology introduces over 53 µModule®(micromodule) power products with SnPb BGA packages, targeting applications where the use of tin-lead soldering is preferred, such as in defense, avionics and heavy equipment industries. A µModule point-of-load regulator with SnPb BGA package simplifies PC board assembly for suppliers in these industries by providing:

1.  Surface mount vs through-hole PCB assembly.

2.  Complete, encapsulated DC/DC regulator circuit in one BGA package vs high component-count, unverified discrete solution.

3.  100% tested point-of-load regulator solutions vs requiring verification and supervision of discrete circuit point-of-load regulator solutions.

4.  Simpler cleaning under the µModule BGA package due to higher standoff compared to flat LGA or QFN packages.

5.  Reflow temperature identical to the other tin-lead components on the PCB vs higher temperature required for point-of-load regulators with Pb-free solder paste.

µModule power products with SnPb BGA packages are offered in four DC/DC converter
categories: (1) step-down or buck converters with single and multiple outputs, (2) buck-boost
converters, (3) isolated converters, and (4) converters with PMBus digital telemetry with READ
and WRITE data capability.

Pb-free (SAC305) versions of these devices and more than 100 µModule products in both
BGA and LGA packages are available at www.linear.com/umodule\

A summary of SnPb BGA µModule power products is provided by clicking here or at
http://lt.linear.com/00w

Source:http://www.linear.com/