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News
NXP Shrinks Automotive Power Package for the Connected Car
2016-05-23 | Return"As more subsystems are crammed into the connected vehicle, the need for rugged, compact power systems are becoming ever greater," said Richard Ogden, product marketing manager, at NXP. "The introduction of the LFPAK33 sets the benchmark for automotive MOSFET performance in a compact package. This extension of the LFPAK portfolio provides designers with more product choices than anything on the market today."
The NXP LFPAK33 package uses a copper clip design to reduce the package resistance and inductance which in turn reduces the RDS(on) and switching losses of the MOSFET. The full NXP range of LFPAKs allows designers the broadest range of devices in this compact footprint.
Key Benefits:
· Ultra-compact footprint – 10.9 mm2
· Thermal Performance – no wires, no glue, 175oC Tj max
· Electrical performance – low package resistance and inductance, up to 70 A max rating
· Extensive portfolio - product range between 30 V – 100 V, as low as 6.3 mΩ
Target Applications
· Next generation engine management
· Chassis and safety
· LED Lighting
· Relay replacement
· C2X systems
· Radar
· Infotainment systems
· Navigation systems
· ADAS
Availability
The new LFPAK33 compact automotive power package is available now. http://www.nxp.com/products/discretes-and-logic/mosfets/automotive-mosfets/lfpak33:LFPAK33?fsrch=1&sr=5&pageNum=1
Source:http://www.nxp.com/