- Abracon
- Adam Tech
- Aerospace, Defense & Marine
- Agastat
- AIC
- AKM Semiconductor
- Alcoswitch
- Allegro
- Alps Electric
- Altera
- AMI Semiconductor
- AMP
- ams
- Analog Devices (ADI)
- Aptina Imaging
- Atmel
- Avago / Broadcom
- AVX
- Axicom
- Bccomponents
- Beyschlag
- BI Technologies
- Bourns Inc.
- Bowei Integrated Circuits
- Bridgelux
- Buchanan
- California Micro Devices
- Catalyst Semiconductor
- CGS
- Cirrus Logic
- Citizen Electronics
- CML Microcircuits
- Coiltronics
- Cooper Bussmann
- Corcom
- Core Logic
- Cree
- CSR PLC
- CTS
- Cypress Semiconductor
- Dale
- Data Image
- Deutsch
- Diodes Incorporated
- DOMINANT Opto Technologies
- E-T-A
- Eaton
- ECS
- Edison Opto
- Elcon
- EPCOS
- Epistar
- Epson
- Everlight Electronics
- Exar
- Fairchild Semiconductor
- FCI
- Freescale Semiconductor
- Fremont Micro Devices (FMD)
- Fujitsu Semiconductor
- Fulltech Electric
- General Semiconductor
- Harvatek
- Holsworthy
- Hsuan Mao Technology
- IDT
- Infineon Technologies
- Innolux
- International Rectifier (IR)
- Intersil
- IRC
- ISSI
- IXYS-IC
- Jing Cheng Electronical
- JL World
- Johanson Dielectrics
- Johanson Technology
- JRC / NJR
- JST
- KEC
- Kilovac
- Kingbright
- Kyocera Industrial Ceramics
- LEDiL
- Linear Technology / ADI
- Lite-On Technology
- Littelfuse
- Lumex
- Lumileds
- Luminary Micro
- Luminus Devices
- Macronix
- Maojwei / ZJPT
- Maxim Integrated
- MCC
- Mean Well Enterprises
- Microchip Technology
- Micron
- Microsemi
- Mini-Circuits
- Molex
- Murata Manufacturing
- Murata Power Solutions
- MWT
- National Semiconductor
- Nichicon
- Nippon Chemi-Con
- NJR / JRC
- NVE
- NXP Semiconductors
- OEG
- Omnivision
- ON Semiconductor
- Optek Technology
- Optrex
- OSRAM Opto Semiconductors
- OTAX
- Panasonic
- Peregrine(pSemi)
- Potter & Brumfield
- Power Integrations
- PowerStor
- Preci-Dip
- Prewell
- Products Unlimited
- Pulse Electronics
- PulseCore Semiconductor
- Qorvo
- Raychem
- Renesas Electronics
- RFMD
- Richtek Technology
- ROHM Semiconductor
- Rubycon
- Samsung Electro-Mechanics
- Samsung Semiconductor
- Schaffner
- Schrack
- Seiko Instruments, Inc. (SII)
- Semtech
- Sensata
- Seoul Semiconductor
- Sfernice
- Sharp Display
- Sharp Microelectronics
- Silicon Labs
- Siliconix
- Skyworks Solutions
- SoniCrest / JL World
- Spansion
- Sprague
- Stanley Electric
- STMicroelectronics
- Sunny Electronics
- Susumu (SSM)
- Taimag
- Taiyo Yuden
- TDK
- TDK-Lambda
- TE Connectivity
- Teccor
- Texas Instruments (TI)
- Thin Film
- Tianma Micro-electronics
- TOCOS
- TOKO
- Toshiba Electronic Components
- TT Electronics
- Tusonix
- TXC
- Tyntek
- Vishay
- Vishay Precision Group
- Vitramon
- Walsin Technology
- Weidmuller
- Welwyn
- Wickmann
- Winbond
- Xilinx
- Yageo
- Zetex Semiconductors
- ZJPT / Maojwei
News
No more workarounds: The new TO-220 FullPAK Wide Creepage Package
2016-04-26 | ReturnMunich, Germany – April 26, 2016 – Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) today introduced the TO-220 FullPAK Wide Creepage package. The new package is offered for the 600 V CoolMOS™ CE, targeting a broad range of low power consumer applications. This package features an improved creepage and has been developed to meet the demanding requirements of open frame power supplies where pollution might lead to arcing failures of applications.
The TO-220 FullPAK Wide Creepage replaces frequently used workarounds to increase creepage distance such as silicon potting, the usage of sleeves, pre-bending of leads or others. Offering a better alternative to workarounds, customers profit from reduced system costs when implementing the new package.
Wide spread pins prevent failures
The TO-220 FullPAK Wide Creepage package targets open frame power supplies such as TV adapters where dust can enter the case through air vents. These dust particles can reduce the effective creepage between pins over time which may lead to high voltage arcing. The new TO-220 FullPAK Wide Creepage package comes with a pin distance of 4.25 mm instead of the prevailing 2.54 mm found in a standard TO-220 FullPAK package.
The other outer dimensions of the new package are almost identical to the TO-220 FullPAK. Additionally, the new Wide Creepage package shows all the well-known benefits of a standard FullPAK, predominantly its excellent isolation behavior as well as the assembly automation ability.
Availability
The TO-220 FullPAK Wide Creepage package is available now. For further information: www.infineon.com/TO220-FP-widecreepage.
Information Number
INFPMM201604-049
Press Photos
No need for workarounds such as silicon potting, the usage of sleeves, pre-bending of leads or others: Infineon’s news TO-220 FullPAK Wide Creepage package helps in reducing overall system costs.
No need for workarounds such as silicon potting, the usage of sleeves, pre-bending of leads or others: Infineon’s news TO-220 FullPAK Wide Creepage package helps in reducing overall system costs.
Source:http://www.infineon.com/