LISLE, IL – January 21, 2016 – Molex, LLC will debut its new Impel™ Plus Backplane Connectors in Molex booth 817 at the DesignCon 2016 Expo, to be held January 20-21 at the Santa Clara Conference Center in Santa Clara, CA. An extension of the Impel™ Backplane Connector family, Impel Plus connectors include a grounding tail aligners and smaller signal compliant pins. An innovative signal beam design improves insertion loss compared to in-line beams and pushes interface resonance frequency past 30 GHz.

In today’s market, telecom and data computing OEMs must deliver ever-faster data rates, but those higher speeds can produce insertion loss and degraded SI performance. OEMS also need to design scalability into their equipment to minimize future infrastructure investments. By delivering optimal SI, reducing crosstalk, and improving insertion loss, the Impel Plus daughtercard module design resolves those key performance issues. Because the connectors are backward and forward compatible, OEMs can meet future data rate needs without replacing infrastructure.

“Impel Plus daughtercard module are designed as upgrade path to the standard Impel modules, and will be available to OEMs to support a next speed bumps or to provide a higher margins in their current systems, “ said Bratislav Kostic, new product development manager, Molex. “Our patent-pending technology, with a tightly coupled differential-pair structure, provides optimal SI and mechanical isolation throughout the connector system.”

The new connectors are ideal for applications in several markets, including telecom and networking (hubs and servers); medical (patient monitoring), and aerospace/defense. Impel Plus connectors are compliant with IEEE 100GBASE-KR, 100GBASE-KP and the Optical Internetworking Forum (OIF) CEI-25G-LR.

Source：http://www.molex.com/