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News
Toshiba Launches Ethernet Bridge Solution for Automotive Applications, including Infotainment and Telematics
2016-01-06 | ReturnJanuary 6, 2016
Chipset enables automotive Ethernet-AVB for next-generation IVI and telematics
TOKYO– Toshiba Corporation‘s (TOKYO: 6502) Semiconductor & Storage Products Company today announced the launch of an automotive-grade Ethernet bridge solution for in-vehicle infotainment (IVI) and other automotive applications. The TC9560XBG supports standards such as IEEE 802.1AS and IEEE 802.1Qav, generally referred to as Ethernet-AVB. The Ethernet-AVB standard enables stable, reliable multimedia transmissions, making it suitable for IVI and telematics.
Sample shipments of the TC9560XBG Ethernet bridge solution and TC9560AXBG, with CAN-FD features, start today, with volume production slated for October 2016.
Automotive electronics are becoming more complex with the addition of advanced sensors, high-resolution displays, on-vehicle cameras, automated driver assistance systems (ADAS), and their data transmission and controls. Connecting these devices with an industry-standard Ethernet protocol contributes to simplified wiring, cost savings, reduced harness weight and improved mileage. Toshiba’s new automotive-grade Ethernet solution also supports Ethernet-AVB, which is an important factor for multimedia applications. In addition, the device will be AEC-Q100[1] qualified to ensure performance in rigorous automotive environments.
Strategy Analytics forecasts that demand for automotive Ethernet will exceed 120 million nodes by 2020[2], driven by increased in- and on-vehicle electronic content, including cameras, sensors, displays, safety systems and convenience solutions. In particular, for emerging autonomous vehicle systems, a reliable, high-speed communications network is an essential requirement.
Connected to an application processor or other system-on-chip (SoC) host, the TC9560XBG allows the host device to deliver audio, video, and data information through the 10/100/1000 Ethernet network in an automotive environment. Connection to the host is achieved via PCI Express® (PCIe®), HSIC or Time Division Multiplex (TDM)/I2S for audio traffic. The IC’s RGMII/RMII[3] interface connects to the Ethernet switch or PHY device, and both AVB and legacy traffic are supported. An on-chip ARM® Cortex®-M3 processor can perform system control and management.
The new chipset will be showcased at the 2016 International Consumer Electronics Show (CES), to be held from January 6 to January 9 in Las Vegas, U.S.A.
Main Specifications
Part Number | TC9560XBG/TC9560AXBG |
---|---|
CPU Core | ARM® Cortex®-M3 |
HOST Interface (External Application) |
|
Automotive Interface |
|
Audio Interface | Selection from I2S or TDM |
Peripheral Interface |
|
Power-Supply Voltage | 1.8V/3.3V (IO) 1.2V (HSIC) 1.8V/2.5V/3.3V (RGMII/RMII/MII) 1.1V (Core) |
Package | P-LFBGA 170 balls, 10mmx10mm, 0.65mm pitch |
Notes:
- AEC-Q100 refers to the stress test qualification for ICs established by the U.S.-based Automotive Electronics Council, which sets qualification standards for all electronics components supplied to the automotive industry. Grade 3 refers to ambient operating temperature range of -40°C to +85°C.
- “Automotive Ethernet Market Growth Outlook,” Strategy Analytics, Oct. 23, 2014.
- Fast Ethernet interfaces: RGMII = Reduced Gigabit Media Independent Interface; RMII = Reduced Media Independent Interface. Support is planned for MII (Media Independent Interface).
*PCI Express and PCIe are registered trademarks of PCI-SIG.
*ARM and Cortex are registered trademarks of ARM Limited (or its subsidiaries) in the EU and/or elsewhere.
- For more information about the new product, please visit:
http://toshiba.semicon-storage.com/ap-en/product/automotive/interface-bridge.html